TTM Technologies, Inc.

TTM Technologies, Inc., together with its subsidiaries, engages in the manufacture and sale of printed circuit boards (PCBs) worldwide. The company operates in two segments, PCB and RF&S Components. It offers PCB products, radio frequency (RF) components, conventional PCBs, RF and microwave circuits, high density interconnect PCBs, substrate-like PCBs, flexible PCBs, rigid-flex PCBs, custom assemblies and system integration products, IC substrates, passive RF components, advanced ceramic RF components, multi-chip modules, and beamforming and switching networks. The company also produces printed circuits with heavy copper cores, as well as embedded and press-fit coins; PCBs with electrically passive heat sinks; and PCBs with electrically active thermal cores. In addition, it offers value-added services, including RF design to specification capability, design for manufacturability, PCB layout design, simulation and testing, and quick turnaround services. The company serves original equipment manufacturers and electronic manufacturing services companies that primarily serve aerospace and defense, data center computing, automotive components, medical, industrial, and instrumentation related products sectors. TTM Technologies, Inc. was incorporated in 1978 and is headquartered in Santa Ana, California.

TTM Technologies, Inc. trades as TTMI on NASDAQ. The company is classified in Technology / Hardware, Equipment & Parts and reports in USD.

The current profile places the business in Hardware, Equipment & Parts. This section is intended to summarize the operating segments, products, geographies, and main revenue lines from official filings.

Latest available fiscal data shows $2.91B of revenue and $177.45M of net income.

Use this area for management strategy, capital allocation priorities, target markets, and measurable goals from the latest annual report or investor presentation.

The app now provides the structure, but exact strategic claims should come from official company documents before being treated as a finished investment thesis.

TTM Technologies, Inc. can be compared against peers such as Badger Meter, Inc., Cognex Corporation, Core Scientific, Inc., The Descartes Systems Group Inc., ESCO Technologies Inc., Littelfuse, Inc..

A complete thesis should compare growth, margins, balance-sheet risk, valuation multiples, and market position against direct competitors.

Current signals to investigate include market capitalization of $17.41B, beta of 2.11, and return on equity of +10.1%.

This section should be validated with evidence such as durable margins, brand strength, regulation, switching costs, cost advantage, distribution, or technology.

Key risks should include financial leverage, cyclicality, customer concentration, regulatory exposure, currency risk, and execution risk.

TTMI currently shows total debt of $1.12B and beta of 2.11. Missing data should be treated as a research gap, not as low risk.

Production-capacity detail is not available as structured data yet. For industrial, defense, semiconductor, or real-estate companies, this should be reviewed from annual reports and investor presentations.

No structured backlog field is available yet. If the company reports backlog, review the relevant filing section before adding it to the thesis.

Use this section for major contracts, product launches, construction projects, acquisitions, or strategic programs that can materially affect valuation.

Recent filings to review: 8-K (2026-06-03 00:00:00), 8-K (2026-05-27 00:00:00), SD (2026-05-22 00:00:00), 8-K (2026-05-18 00:00:00).

Customer concentration is not available as structured data here. Add it from official filings when a company discloses material customers or revenue concentration.

Supplier concentration and critical supply-chain dependencies are not available as structured data here. This should be researched from annual reports and risk disclosures.

Company website: https://www.ttm.com

For US-listed stocks, verify the thesis against official filings, earnings call transcripts, and company investor relations materials.