Taiwan Semiconductor Manufacturing Company Limited

Taiwan Semiconductor Manufacturing Company Limited, together with its subsidiaries, manufactures, packages, tests, and sells integrated circuits and other semiconductor devices in Taiwan, China, Europe, the Middle East, Africa, Japan, the United States, and internationally. It provides a range of wafer fabrication processes, including processes to manufacture complementary metal- oxide-semiconductor (CMOS) logic, mixed-signal, radio frequency, embedded memory, bipolar CMOS mixed-signal, and others. The company also offers customer and engineering support services; manufactures masks; and invests in technology start-up companies; researches, designs, develops, manufactures, packages, tests, and sells color filters; and provides investment services. Its products are used in high performance computing, smartphones, Internet of things, automotive, and digital consumer electronics. The company was incorporated in 1987 and is headquartered in Hsinchu City, Taiwan.

Taiwan Semiconductor Manufacturing Company Limited trades as TSM on NYSE. The company is classified in Technology / Semiconductors and reports in USD.

The current profile places the business in Semiconductors. This section is intended to summarize the operating segments, products, geographies, and main revenue lines from official filings.

Latest available fiscal data shows $3.85T of revenue and $1.74T of net income.

Use this area for management strategy, capital allocation priorities, target markets, and measurable goals from the latest annual report or investor presentation.

The app now provides the structure, but exact strategic claims should come from official company documents before being treated as a finished investment thesis.

Taiwan Semiconductor Manufacturing Company Limited can be compared against peers such as Applied Materials, Inc., Amkor Technology, Inc., ASML Holding N.V., ASE Technology Holding Co., Ltd., Broadcom Inc., Diodes Incorporated.

A complete thesis should compare growth, margins, balance-sheet risk, valuation multiples, and market position against direct competitors.

Current signals to investigate include market capitalization of $2.15T, beta of 1.26, and return on equity of +32.4%.

This section should be validated with evidence such as durable margins, brand strength, regulation, switching costs, cost advantage, distribution, or technology.

Key risks should include financial leverage, cyclicality, customer concentration, regulatory exposure, currency risk, and execution risk.

TSM currently shows total debt of $1.06T and beta of 1.26. Missing data should be treated as a research gap, not as low risk.

Production-capacity detail is not available as structured data yet. For industrial, defense, semiconductor, or real-estate companies, this should be reviewed from annual reports and investor presentations.

No structured backlog field is available yet. If the company reports backlog, review the relevant filing section before adding it to the thesis.

Use this section for major contracts, product launches, construction projects, acquisitions, or strategic programs that can materially affect valuation.

Recent filings to review: 6-K (2026-06-04 00:00:00), 3 (2026-06-01 00:00:00), 3 (2026-06-01 00:00:00), 3 (2026-06-01 00:00:00).

Customer concentration is not available as structured data here. Add it from official filings when a company discloses material customers or revenue concentration.

Supplier concentration and critical supply-chain dependencies are not available as structured data here. This should be researched from annual reports and risk disclosures.

Company website: https://www.tsmc.com

For US-listed stocks, verify the thesis against official filings, earnings call transcripts, and company investor relations materials.