Apr 21, 2026, 8:00 AMglobenewswire.comISRL
ISRL USA and AI Infrastructure Partners Sign MOU to Build America's First Dedicated Semiconductor SubFAB R&D Facility
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AUSTIN, Texas, April 21, 2026 (GLOBE NEWSWIRE) -- International SubFAB Research Labs (ISRL USA) and AI Infrastructure Partners (AIIP) today announced a memorandum of understanding (MOU) to design, build, and operate the United States' first purpose-built research and development facility dedicated to semiconductor subfab infrastructure—a critical step toward enabling sustainable, high-volume semiconductor manufacturing at scale. The platform will support a broad ecosystem including independent device manufacturers (IDMs), foundries, OEMs, subfab suppliers, materials companies and research institutions.
