SK hynix unveils 'iHBM' thermal solution to boost AI performance

Enhances heat dissipation by integrating ICEs into the HBM package Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility SEOUL, South Korea, May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) [1] within the high-bandwidth memory(HBM) package for next-generation HBM products. [1] ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-based material, designed to dissipate heat from the HBM package by providing an additional thermal path.