Fujifilm Presents Latest Advanced Packaging Research Results and Will Introduce PFAS-Free PBO at ECTC 2026

TOKYO & NORTH KINGSTOWN, R.I.--(BUSINESS WIRE)--FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES1 product line of photosensitive insulating materials, including PFAS-free2 PBO, at the Electronic Components and Technology Conference 2026 (ECTC 2026), May 26–29, 2026, in Orlando, Florida. As part of the conference's technical program, Fujifilm will present the results of joint research conducted with imec, a leading in.