Applied Materials Announces Broadcom as EPIC Innovation Partner

Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems  Partnership will leverage Applied's global network of innovation centers, including new EPIC Center in Silicon Valley SANTA CLARA, Calif., May 20, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced that Broadcom Inc. (Nasdaq: AVGO) will join Applied's EPIC platform as an innovation partner to accelerate development of advanced chip packaging technologies critical to next-generation AI systems.