Wolfspeed Unveils Foundation for Next‑Generation AI Data Center Advanced Packaging Leveraging 300mm Silicon Carbide Technology

DURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. “As AI workloads continue to increase package size, power density, and integration complexity, we believe new materials foundations will be increasingly important to.